Research Institute of Shanghai Jiaotong University, micro and nano research group led by Professor Zhang Yafei successfully welded carbon nanotubes and metal electrodes, in the nano-device fabrication technology has made important progress.
Industrial processing of semiconductor devices is currently the smallest feature size is about 65 nm, and further reduce the line width in terms of the complexity of the process or the processing cost will be greatly improved, thus limiting the faster, smaller, colder and lower prices e
Development of the device. In recent years, many of the world making use of nano-functional materials scientists bottom (Bottom-Up) Method for production of nano-devices build the research, however, the lack of nano-materials and metal electrodes to achieve reliable integration between
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Method of limiting the development of the research.
Professor Zhang Yafei research group through the use of ultra-high frequency sound waves of a slightly sub-trillion pressure head vibration on the surface of carbon nanotubes in a metal pressure successfully embedded and welded carbon nanotubes to metal electrodes to form a reliable electricity connections and key contacts
Co. Experimental results show that carbon nanotubes and metal nano-welding electrode has strong mechanical strength, the use of carbon nanotubes formed welded superior performance of nanoelectronic devices; They also proved by further experiments, the technology not only
Applicable to many types of one-dimensional materials such as Si, SiC nanowires between the electrodes, etc. and metal bonding, and can be applied to other nano-materials and metal and composite bonding between the processes. Therefore, the nano-welding technology breakthrough in processing technology of nano-devices
The bottleneck operation, the use of Bottom-Up solution prepared nano-devices based on nano-materials satisfied a key manufacturing technology (From "National Chiao Tung University News")
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